Wolkom by Shenzhen Hengda Electronics Limited

PCB Capability

PCB produksjeproses

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Standert PCB mooglikheden - Gewoane PCB

Kategoryen Nee. items PCB proses parameters Remarks
normaal proses medium swierrichheden hege swierrichheden  
Non-standert resinsje Net mooglik om te meitsjen  
produkt type 1 Multilayer PCB Lagen 3L≤Layers≤16L 18L≤Layers≤24L ≥24L    
2 Blinen en Buried Vias HDI (1 + 1 + .... + N + ...... + 1 + 1) Anylayer HDI HDI (2 + ... + N ... + 2)   As oan de easken fan 2, 6 en 19 tagelyk, dan wurdt klassifisearre as in hege eask produkt (dikte ta diameter ratio, koper dikte fan gat)
3 surface Coating HASL (+ gouden finger), immersion goud, Streektaal Gold + gouden fingers mei hurde goud, OSP (+ gouden finger mei hurde goud), Streektaal Tin (+ gouden finger mei hurde goud) (Net twa ferskillende oerflak finish), Streektaal Tin Lokale immersion goud (lang of koart gouden fingers, Segmented gouden finger craft) Heger wêze as dit berik nedich unconventional produksje prosessen   Partial immersion goud, dikte fan goud of nikkel ferwizing nei de dikte fan de coating
4 board Material FR-4; aluminium, Rogers4 rige + FR-4 mingd (The Prepreg is Shengyi merk en ROGERS4403 series); Cem-3, LianMao IT158 / IT180A Pure ROGERS4 rige multi-laach board (Prepreg is 4450F), PTFE, aluminium + FR4, PTFE + FR4 Heger wêze as dit berik nedich unconventional produksje prosessen Pure PTFE multi-laach board Pure PTFE kin net makke wurde omdat de lamination temperatuer is net oan standert, Kin net laminaat Rogers koper foil direkt
boren 5 drill diameter nc drill 0.20mm≤Drill diameter≤6.5mm Mear as 6.0mm brûkend CNC milling
gat diameter 0.2mm: maksimale bestjoer dikte 1.6mm
gat diameter diameter 0.25mm: maksimale bestjoer dikte 2.0mm,
gat diameter 0.3mm≤Ф≤0.35mm, maksimum board dikte 3.2 mm,
gat diameter 0.4mm≤Ф≤0.55mm, maksimum board dikte 4,8 mm,
gat diameter> 0.55mm maksimale board dikte 6.4 mm
6.5mm of mear ± 0.1mm ≤ gat diameter ferdraachsumens (brûkende CNC milling foar 6.5mm of mear) De drill diameter mear as 6.0mm, it gat diameter tolerânsje minder as ± 0.1mm. As heger wêze as dit berik fereaskje unconventional produksje prosessen   Drill diameter ûnder 0.2mm, en it aspekt ratio≥10, dat is middelgrut muoite
6 Dikte to diameter ratio Dikte to diameter ratio≤8 8 10 Dikte oan diameter ratio grutter as 12 doe't it diafragma kin net kompensearre As needsaak om te foldwaan oan de eask fan 2, 6 en 19, dan sil wêze traktatie sa heech ferplichting produkt.
7 countersink gat diameter 3.0mm≤hole diameter≤6.5mm   Unconventional produksje foarby dit berik   Countersink djipte tolerânsje wurdt oanstjoerd 0.15mm
Hoeke 90 °   Unconventional produksje foarby dit berik  
8 Hole posysje tolerances ± 0.075mm   ± 0.05mm <+ />-0.05mm  
9 gat diameter ferdraachsumens PTH ± 0.075mm of gjin klant easken ± 0.05≤ gat diameter tolerânsje <± 0.75mm <± 0.05mm <+ />-0.05mm Metallized gat diameter tolerânsje fan 6.0mm of mear ferwiist nei de eask fan serial number 5
NPTH ≥ ± 0.075mm   <± 0.05mm <+ />-0.025mm
Special gat pressfit ≤ ± 0,05 \ \    
non-plated Countersink / Counterbore gatten (NPTH) gat diameter <10mm: tolerânsje ± 0.15mm, gat = ± 0.15mm, gat diameter = diameter ≥10mm: ferdraachsumens = ≥10mm: tolerânsje ± = ± 0.20mm = 0.20mm \ \    
non-plated Countersink / Counterbore gatten (NPTH) gat diameter <10mm: tolerânsje ± 0.2mm = ± 0.2mm
gat diameter ≥10mm: tolerânsje + 0.3mm
\ \    
10 Gat to gat spacing komponint gat ≥10MIL 8≤Hole to gat spacing≤10 7≤Hole to gat spacing≤8 <7mil  
via (≤0.45mm) ≥8MIL        
11 Slot (Cut-out) slot breedte Plated slot ≥0.5mm
non-plated slot ≥0.8mm
\ \   Mear dan 1.0mm, kin wêze slot troch machine
Lingte oan breedte ratio fan slot Lingte oan width≥2 Lingte oan breedte <2      
12 Castellated Holes Castellated Holes diameter ≥0.5mm 0.5mm> diameter≥0.4mm \    
Castellated Holes ôfstân (Edge oan rand) ≥0.3mm 0.3mm> diameters≥0.2mm \    
  13 Minimum isolemint ring fan Sintrale laach,
De ôfstân tusken minimum gat yn Sintrale laach en sirkwy (foar skeafergoeding)
4L ≥7MIL 6MIL≤isolation ring, ôfstân <7mil 5MIL≤isolation ring, ôfstân <6mil   As de grutte fan de iene kant grutter is as 600MM, de ynderlike gat oan line en it gat oan koper spacing moat grutter wêze as of gelyk oan 15mil. At minder as 15mil, dan moat wurde behannele as unconventional resinsje. De konvinsjonele proses fan 10 lagen of mear nedich wurde incremented troch 1 mil foar eltse ekstra 2 lagen. Feroarje it isolemint ring oan 12mil of mear sa folle as mooglik
  6L ≥8MIL 6.5MIL≤isolation ring, ôfstân <8mil 6MIL≤isolation ring, ôfstân <6.5mil  
  8L ≥9MIL 7MIL≤isolation ring, ôfstân <9mil 6MIL≤isolation ring, ôfstân <7mil  
  ≥10L ≥10MIL 8MIL≤isolation ring, ôfstân <10mil <9MIL 7MIL≤isolation ring, ôfstân <8mil  
image oerdracht 14 De min breedte / ôfstân fan ynderlike laach (foar skeafergoeding) cooper thickness 18um ≥4 / 4 Mil ≥4 / 3.5 Mil   <3.5 /> 3 mil width / spacing
cooper thickness 35um ≥4 / 5 mil ≥4 / 4 Mil   <3.5 /> 4 Mil width / spacing
cooper thickness 70um ≥6 / 8mil ≥6 / 7mil   <5 /> 6 Mil width / spacing
cooper thickness 105um ≥8 / 11 Mil ≥8 / 10 Mil   <6 /> 9 Mil width / spacing
15 De min breedte / ôfstân fan de bûtenste laach (foar skeafergoeding) cooper thickness 18um ≥4 / 5 mil ≥4 / 4 mil of ûnderdielen 3.5 / 3.5mil   <3.5 />3.5 mil Lokale 3.5 / 3.5mil, allinne de ôfstân fan de GBA chip gebiet line oan de PAD
cooper thickness 35um ≥5 / 6 mil ≥5 / 5 mil   <4 /> 4 Mil  
cooper thickness 70um ≥7 / 8mil ≥6 / 7mil   <5 /> 6 Mil  
cooper thickness 105um ≥10 / 12 Mil ≥8 / 10 Mil   <6 /> 9 Mil  
16 grid trace breedte / spacing cooper thickness 18um ≥7 / 9 Mil ≥6 / 8 Mil   <6 /> 7 Mil  
cooper thickness 35um ≥9 / 11 Mil ≥8 / 10 Mil   <8 /> 9 Mil  
cooper thickness 70um ≥11 / 13mil ≥10 / 12mil   <10 /> 11 Mil  
cooper thickness 105um ≥13 / 15 Mil ≥12 / 14 Mil   <12 /> 13 Mil  
17 Minimum weld ring (Outer laach) cooper thickness 18um via hole ≥5mil ≥4mil <3 mil = mil    
komponint gat ≥8mil ≥6mil <6 mil = mil    
cooper thickness 35um via hole ≥5mil ≥4mil <3 mil = mil    
komponint gat ≥10mil ≥8mil <8 mil = mil    
cooper thickness 70um via hole ≥7mil ≥6mil <5 mil = mil    
komponint gat ≥12mil ≥10mil <10 Mil = mil    
cooper thickness 105um via hole ≥8mil ≥6mil <6 mil = mil    
komponint gat ≥14mil ≥12mil <12 Mil = mil    
18 breedte tolerânsje   breedte tolerânsje: ≥ ± 20% ± 10% ≤ breedte tolerânsje: <± 20% <± 10%   spacing moatte foldwaan oan de easken fan 11 en 12, LF breedte is grutter as 15mil, bestjoerd troch ± 2.5mil
BGA pad diameter hite lucht nivellering (original) ≥12MIL ≥10MIL   <8mil  
immersion goud (original) diameter≥11mil 8.0mil≤diameter <11.0mil   <6mil  
19 Line oan board rand ôfstân CNC milling 0.25mm 0.20mm <0.20mm    
SMT width   ≥12mil ≥9mil <9mil 以下   <7mil, útsein it = de binende = binende board = board
Metal plating 20 Plating Thickness (μin) Electroless Nikkel-Streektaal Gold, enig Nikkel dikte 100-150 μin 200 μin      
gold dikte 1-8 μin     > 8 μin  
Folsleine board gouden plating Nikkel dikte 100-150 μin   200-500 μin   Bestel sintrum check de definitive priis
gold dikte 1-10 μin 10-50 μin   > 50 μin
gold finger Nikkel dikte 120-150 μin   200-400 μin  
gold dikte 1-30 μin 30-50 μin   > 50 μin
21 Hole Koper thickness (μm) Troch it gat 18-25 μm 30-50 μm > 50 μm   As 2,6,19 is nedich te bestean tagelyk, dan wurdt behannele as hege eask. De dikte fan it koper is 25-50UM, en de dikte fan it koper is nedich te wêzen 2-3OZ algemien.
Bline gat (meganyske gat) 18-25 μm 30-50 μm > 50 μm
begroeven gat 15-25 μm 30-50 μm > 50 μm
22 Bottom Koper dikte Binnenste en bûtenste koper dikte (OZ) 0.5-4 4-6   > 6  
solder masker 23 solder masker griene solder masker opening (mil) ≥2mil 1.5 1   1mil wurdt allinne konsintrearre yn it BGA gebiet. As it rút kin fergrutte, fergrutsje dat safolle mooglik, mar de maksimum is 3mil
griene solder masker Bridge (mil) cooper thicknesss <2oz 4 (Spaasjes tusken ICs is 8 mil, griene oalje), bûnte of swarte oil≥4.5mil 3-4 (Spaasjes tusken ICs is 7-8 mil, griene oalje), bûnte of swarte oil≥4mil      
cooper thicknesss≥2OZ 5 4      
Plug Hole diameter 0.20mm≤hole diameter≤0.40mm, plug gat follens 70% 0.4mm <gat diameter ≤0.70mm follens 100%    
Plug Hole board dikte 0.40mm≤board thickness≤2.4mm > 2.4MM      
24 solder masker solder masker kleur Grien, matt grien, blau, read, swart, matte swart, wyt, giel \ \   Spesjale kleuren moatte wurde oankocht of ynsetten fan tefoaren
silkscreen 25 Etste silkscreen (dien koper dikte) Koper dikte 18um wurd width / wurd height 8MIL / 40MIL 7MIL / 35MIL      
Koper dikte 35um wurd width / wurd height 9MIL / 40MIL 8MIL / 35MIL      
Koper dikte 75um wurd width / wurd height 12MIL / 60MIL 10MIL / 50MIL      
Koper dikte 105um wurd width / wurd height 16MIL / 60MIL 14MIL / 50MIL      
outline 26 Maksimum board dikte Double PCB 3.2MM 4.5MM > 4.5MM   berekkene troch 4 lagen as de dikte mear as 3mm
Multilayer laach board 3.2MM 4.5MM > 4.5MM    
27 Minimum board thickness (single en dûbele paniel ferwiist nei substraat dikte) Single of Double side PCB (PCB prototype) ≥0.3mm 0.25mm      
4L ≥0.60mm 0.40mm <0.40mm    
6L ≥0.9mm 0.70mm <0.70mm    
8L ≥1.20mm 1.00mm <1.00mm    
10L ≥1.40mm 1.20mm <1.20mm    
12L ≥1.70mm 1.50mm <1.50mm    
14L ≥2.00mm 1.80mm <1.80mm    
28 dikte (T) ferdraachsumens MM (multilayer laach PCB) T≤1.0 ± 0.10   Need om resinsje as minder as de tolerânsje   As de tolerânsje is iensidich tolerânsje, de tolerânsje scil wêze dûbele tolerânsje wearde, sa as: 1.8mm ferget posityf tolerânsje, de tolerânsje scil wêze 0-0.36mm
1.0 <t≤1.6 <td = ""> ± 0.13  
1.6 <t≤2.5 <td = ""> ± 0,18  
2.5 <t≤3.2 <td = ""> ± 0,23  
T≥3.2 ± 8%  
29 Maksimum klear board grutte Inkelde en dûbele kant PCB 508 × 610mm Beyond dit berik moat it wurde    
Multilayer Laach PCB 508 × 600mm
30 Minimale klear PCB grutte   ≥20mm 10mm≤Size <20mm <10mm    
31 Beveling foar gold finger bevel angle 20 ° 30 ° 45 ° 60 °   <20 ° of> 60 °    
Bevel angle ferdraachsumens > ± 5 ° ± 5 ° <± 5 °    
Bevel djipte ferdraachsumens tolerance≥ ± 0.15mm ± 0.15mm <Tolerânsje ≤ ± 0.1mm ferdraachsumens <± 0.10mm    
32 shape ferdraachsumens   tolerance≥ ± 0.15mm ± 0.10mm≤tolerance <± 0.15mm   Tolerânsje <± 0.10mm of = of mear = mear as = as twa = twa foarm = formulier foarm = formulier foarm = formulier foarm = formulier foarm = formulier foarm = formulier foarm = formulier foarm = formulier tolerânsje = tolerânsje control = kontrôle  
33 V-cut Hoeke 20 ° 30 ° 45 ° 60 °        
It Maksimum oantal V-cut Yn 20 kear Yn 30 kear Yn 40 kear    
Breedte fan de foarm 80mm <width <560mm 60mm <width <80mm width <60mm    
board dikte 0.6MM ≦ thickness ≦ 2.4MM 0.5MM ≦ thickness <0.6mm dikte <0.5mm of = of dikte = dikte> 2.4MM   ûnder 0.5mm is single-sided V-cut
oerbleaune dikte ≥0.25MM     <0.25mm  
V-cut Konvinsjonele V-CUTT, V-CUT: Skip V-cut \ \    
oaren 34 panel grutte De minimale paniel grutte ≥100 * 120mm \ <100 * 120mm   De dikte fan it ôfmakke bestjoer is minder as 0.4MM, it paniel grutte kin net boppe 14inch, en de maksimale grutte fan de HASL PCB kin net boppe 24inch
de Maksimum paniel grutte ≤20 * 24 inch \ Need om resinsje as bûten berik  
35 Impedanz control Impedanz control ferdraachsumens ± 10%, 50Ω en hjirûnder: ± 5Ω \ <± 10%, 50ω en = en ûnder = hjirûnder <± 5Ω    
bôge en twist bôge en twist tolerânsje bôge en twist≥0.75% 0.75% ≤bow en twist≤0.5% Bôge en twist <0.5%   asymmetry boards bôge en twist tolerânsje 1.2%
36 HASL ferwurkjen kapasiteit komponint gat diameter gat diameter> 0.5mm 0.4mm≤hole diameter≤0.5mm      
board dikte 0.5mm≤board thickness≤3.5mm 0.4mm≤board thickness <0.5mm      
dikte 2um≤thickness of Tin≤30um \ \    
37 Akseptaasje kriteria IPC standard IPC2 nivo standard IPC Level 3 standert